Gaya APA
Subrahmanian, Eswaran, Odumosu, Toluwalogo, Tsao, Jeffrey Y.. (2018).
Engineering a better future :interplay between engineering, social sciences, and innovation .
Cham, Switzerland:
Springer Open.
Gaya Chicago
Subrahmanian, Eswaran, Odumosu, Toluwalogo, Tsao, Jeffrey Y..
Engineering a better future :interplay between engineering, social sciences, and innovation.
Cham, Switzerland:
Springer Open,
2018.
Ebook.
Gaya MLA
Subrahmanian, Eswaran, Odumosu, Toluwalogo, Tsao, Jeffrey Y..
Engineering a better future :interplay between engineering, social sciences, and innovation.
Cham, Switzerland:
Springer Open,
2018.
Ebook.
Gaya Turabian
Subrahmanian, Eswaran, Odumosu, Toluwalogo, Tsao, Jeffrey Y..
Engineering a better future :interplay between engineering, social sciences, and innovation.
Cham, Switzerland:
Springer Open,
2018.
Ebook.